Lightwave Logic (LWLG) is a public material and device development company that is commercializing its leading Organic Nonlinear Polymers for a variety of electro-optic devices that will be part of our polymer PIC platform. The primary applications for our polymer PIC platform will in high-speed fiber-optic telecom and data communications. Our development roadmap focuses on addressing 100Gbps opportunities using 25Gbps polymer modulators, and 400Gbps opportunities using 50Gbps modulators. We will be advancing our modulator performance to data rates beyond 50Gbps.  Our materials and devices are extendable into other applications, including sensing, IoT, defense, and consumer markets. We are seeking a Photonic Integrated Circuit (PIC) design engineer to work in our facility in Englewood, CO (as part of the Denver Tech Center). Lightwave offers competitive compensation and benefits along with a fast-paced working environment.

Lightwave Logic is seeking an experienced PIC fabrication engineer with III-V compound semiconductor experience to enhance the company’s activities in developing our polymer PIC platform. This position requires hands-on experience in the fabrication and processing of PIC circuits, working with PDKs in a development environment.  Manufacturing fabrication techniques and working with III-V foundries would be a plus.   The successful candidate will play a key role in the fabrication and development of process travelers for our polymer PIC platform.

Specific duties will include:
        • Fabrication and processing of active and passive devices III-V devices (experience with the fabrication of InP DFB lasers with typical regrowths is required)
        • Familiarity of III-V compound semiconductors and silicon based material systems
        • Ability to create and design new PDKs in III-V materials, with new and novel design process travelers
        • Experience with production processes such as CPK and standardized metrics for fabrication plants.
        • Basic optical high speed characterization and test skills e.g. optical loss, optical modal properties and other passive/active characteristics of active and passive photonic devices
        • Working effectively as part of an inter-disciplinary engineering team that includes device designers, micro-fabrication engineers, packaging and test engineers and technicians.
Experience and Education Requirements
        • Minimum B.S. or M.S. (preferably PhD) in a relevant field, preferably physics, or electrical or optical engineering.
        • Post graduate experience in fabrication, processing, and wafer techniques for high-speed photonic devices as part of a PIC platform. A plus would be a solid background in III-V and/or silicon photonic PIC platforms and experience fabricating commercial PIC circuits.
        • Three to five years’ experience working in III-V fabrication plant. A plus would be experience in a commercial advanced development and manufacturing environment where III-V PIC platforms have been productized.